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ARCHIVED - Cleanroom at NINT

NINT Cleanroom Facility has a 330 m² of ISO Class 6 (1,000) area and 115 m² of ISO Class 7 (10,000) facility and is  located on the basement level. It is a modified ‘ballroom’ layout broken into eight separate bays with a central corridor and a service chase around the perimeter. All utilities are run either under the floor or through ‘portholes’ in the end walls.

Services available include high purity N₂, compressed air, chilled demineralized water and deionized (DI) water.  NINT has its own DI plant which is capable of producing 54 gallons/min of electronic grade water. The water is delivered to the bays via a sub-floor piping system and is limited to cleanroom use.

Originally designed as a semiconductor facility,  the NINT Cleanroom Facility’s capabilities have been refined  in order to better complement the current toolset at the University of Alberta’s Nanofab. This will allow users of both facilities to benefit from a more diversified toolset.

The toolset continues to expand, with tools being selected with the help of the research community based on the work being conducted at NINT. At the moment there are several tools online and ready for use by client groups.

To obtain more information or to submit a facility access request, please e-mail it to: NINT_request@nrc-cnrc.gc.ca.   

Deposition Tools

1. Oxford Industries FlexAL
   Atomic Layer Deposition (ALD)
   •  Located in the Class 1000 cleanroom
   •  Up to 4 liquid or gas precursors
   •  Conformal growth is self-limited and based on surface reactions.
   Current capabilities include Al2O3, TiO2 and TIN
   
   
2. Johnsen E-Beam Evaporation System
   •  Recently upgraded user friendly software
   •  Samples from pieces up to 8 – 4” wafers
   •  6 source pockets for deposition material
   •  Programmable sweep patterns
   •  Programmable deposition rates and thickness
   •  RGA
   •  Deposition meterials dielectrics and metals
   
   
   
   
3. Tystar Mini – Titan 4600 LPCVD Reactor
   • Modified for SNW and CNT manufacturing
   • Can process up to 50 4” wafers
   • 2 empty tubes for future expansion
   • Current Processes
   – carbon nanotube growth
   – silicon nanowire growth
   – wet oxide growth
   – poly-Si deposition
   
   
   
   

Dry Etch

1. Oxford Industries Plasmalab 100
   Chlorine Etcher
   •  Installation is underway
   •  Conductor, Semiconductor, Insulator and Polymer etches
   •  Metal and dielectric etch capabilities
   •  Heated/cooled chuck
   •  Canned recipes and support available through vendor
   •  Configured for up to 12 gases , 8 Toxic and 4 non-toxic, to allow for maximum process flexibility
   
   
    
2. Tegal 901e Plasma Etcher
   • Resist strip
   Descum

Wet Etch

1. 8’ Poly Pro ReynoldsTech Wet Deck
    
2. 6’ Weslan Poly Pro Acid Wet Deck
    
3. 4’ Bold Technologies Poly Pro HF Wet deck
4. 7’ SS Reynolds Tech Solvent Wet deck
5. Semitool 4” Spin,rinse, Dryer (SRD)
6. Idonus VPE150
   •  HF vapour Phase etcher
   •  Electrostatic chuck
   •  Small pieces up to 6” substrate
   
   

Lithography
 

1. NANONEX NX-2500 (NIL)
   •  All forms of Nanoimprint
   – Thermoplastic
   – Photo curable
   –  Simultaneous Thermal and UV
   –  Embossing
   •  Sub 10nm resolution
   •  Sub 1 um overlay alignment
2. Quintel 4000 contact Aligner
   •  Can handle partial, 4” or 6”  substrates
   •  Pressure and vacuum contact exposure  modes    ? 
   •  Manual, auto and first expose capabilities
   •  Constant  intensity meter
   
   
3. • Y.E.S – H.M.D.S. Vapour Prime Oven
   –  Dehydration bake
   –  Application of adhesion promoter
   –  General access
4. •  Site Services XP – Combo
   –  Semi automatic coat/bake/develop
   –  Capable of processing small pieces up to and including 6" wafers
   –  General access

5. •  Bidtech SP -100
   –  Manual spinner
   –  General access
   
   

Metrology

1. Filmetrics F-50
   •  Thickness mapping system
   •  Used to measure thickness of dielectrics, semiconductors and thin metal films
   •  Films must be optically
   •  Smooth and between 100Å and 450 microns
   •  Up to 8” diameter
2. KLA-Tencor P-10
   •  Surface Profilometer – ( Step Height Measurement Tool)
   •  Precise measurements of profiles of roughness less then 10Å and features below 100Å
   •  Low noise characteristics allow a repeatability of 8Å maximum in the 6.5um range
3. Ultracision, Inc 680E
   •  Semi-automatic Probe Station
   •  2 – left hand and 2 – right hand  positioners for device testing
   •  Keithly 2602 Dual Channel System Source Meter
4. 2 Olympus optical inspection microscopes
   •  Image capture system
   •  BF and DF
   •  Nomarski Interference Contrast (NIC ) filter to enhance contrast
5. Lucas 4 – Point Probe

Assembly

1. Model K&S 4523 Wedge Bonder
   •  30/45 degree wire feed angle
   •  Ultrasonic Generator
   •  2 channel independent Bonding Parameters
   •  Semi – auto and manual  Z Bonding modes
   •  Built in digital temperature controller
   •  Heated chuck/sample holder
   •  Al and Au wire
2. 7200CR-79 Epoxy Die Bonder
   •  Height adjustment
   •  Epoxy dispense tool
   •  Die pickup and placement tool with die rotation capability
3. LSD – 100 Scribe and Break Tool
   • Roller style breaker
   • Motorized Rotation Control
   • 4” wafer capacity
   • Colour camera
   • Machine control software
   • Windows XP

Related Information

Institutes:

• National Institute for Nanotechnology